Comparison Zalman CNPS10X Optima II vs Zalman CNPS10X Performa ST

The diameter of the fan(s) used in the cooling system.

In general, larger fans are considered more advanced than smaller ones: they allow you to create a powerful air flow at a relatively low speed and low noise level. On the other hand, a large diameter means large dimensions, weight and price. As for specific figures, 40 mm and 60 mm models are considered miniature, 80 mm and 92 mm are medium, 120 mm and 135 / 140 mm are large, and even 200 mm fans are found in the most powerful case systems.

The type of bearing used in the cooling fan(s).

The bearing is the piece between the rotating axle of the fan and the fixed base that supports the axle and reduces friction. The following types of bearings are found in modern fans:

— Sliding. The action of these bearings is based on direct contact between two solid surfaces, carefully polished to reduce friction. Such devices are simple, reliable and durable, but their efficiency is rather low — rolling, and even more so the hydrodynamic and magnetic principle of operation (see below), provide much less friction.

— Rolling. They are also called "ball bearings", since the "intermediaries" between the axis of rotation and the fixed base are balls (less often — cylindrical rollers) fixed in a special ring. When the axis rotates, such balls roll between it and the base, due to which the friction force is very low — noticeably lower than in plain bearings. On the other hand, the design turns out to be more expensive and complex, and in terms of reliability it is somewhat inferior to both the same plain bearings and more advanced hydrodynamic devices (see below). Therefore, although rolling bearings are quite widespread nowadays, however, in general, they are much less common than the mentioned varieties.

— Hydrodynamic. Bearings of this type are filled with a special liquid; wh...en rotated, it creates a layer on which the moving part of the bearing slides. In this way, direct contact between hard surfaces is avoided and friction is significantly reduced compared to previous types. Also, these bearings are quiet and very reliable. Of their shortcomings, a relatively high cost can be noted, but in fact this moment often turns out to be invisible against the background of the price of the entire system. Therefore, this option is extremely popular nowadays, it can be found in cooling systems of all levels — from low-cost to advanced.

— Magnetic centering. Bearings based on the principle of magnetic levitation: the rotating axis is "suspended" in a magnetic field. Thus, it is possible (as in hydrodynamic ones) to avoid contact between solid surfaces and further reduce friction. Considered the most advanced type of bearings, they are reliable and quiet, but expensive.

The lowest speed at which the cooling fan is capable of operating. Specified only for models with speed control (see below).

The lower the minimum speed (with the same maximum) — the wider the speed control range and the more you can slow down the fan when high performance is not needed (such a slowdown allows you to reduce energy consumption and noise level). On the other hand, an extensive range affects the cost accordingly.

The maximum airflow that a cooling fan can create; measured in CFM — cubic feet per minute.

The higher the CFM number, the more efficient the fan. On the other hand, high performance requires either a large diameter (which affects the size and cost) or high speed (which increases the noise and vibration levels). Therefore, when choosing, it makes sense not to chase the maximum air flow, but to use special formulas that allow you to calculate the required number of CFM depending on the type and power of the cooled component and other parameters. Such formulas can be found in special sources. As for specific numbers, in the most modest systems, the performance does not exceed 30 CFM, and in the most powerful systems it can be up to 80 CFM and even more.

It is also worth considering that the actual value of the air flow at the highest speed is usually lower than the claimed maximum; see Static Pressure for details.

The maximum static air pressure generated by the fan during operation.

This parameter is measured as follows: if the fan is installed on a blind pipe, from which there is no air outlet, and turned on for blowing, then the pressure reached in the pipe will correspond to the static one. In fact, this parameter determines the overall efficiency of the fan: the higher the static pressure (ceteris paribus), the easier it is for the fan to “push” the required amount of air through a space with high resistance, for example, through narrow slots of a radiator or through a case full of components.

Also, this parameter is used for some specific calculations, however, these calculations are quite complex and, usually, are not necessary for an ordinary user — they are associated with nuances that are relevant mainly for computer enthusiasts. You can read more about this in special sources.

The ability to replace a regular fan by the user himself — without contacting a service centre or repairmen. The maximum that may be required for such a procedure is the simplest tools like a screwdriver; sometimes they are even initially included in the cooling system kit.

The fan, as the most mobile part of any cooling system, is more prone to breakdowns and failures than other parts. In cases like this, it's cheaper (and often smarter) to replace just that part rather than buying a whole new system. Also, if desired, you can change a working fan — for example, to a more powerful or less noisy one.

The type of contact between the heat pipes provided in the heatsink of the cooling system and the cooled components (usually the CPU). For more information about heat pipes, see above, and the types of contact can be as follows:

— Indirect. The classic version of the design: heat pipes pass through a metal (usually aluminium) base, which is directly adjacent to the surface of the chip. The advantage of such contact is the most even distribution of heat between the tubes, regardless of the physical size of the chip itself (the main thing is that it should not be larger than the sole). At the same time, the extra piece between the processor and the tubes inevitably increases thermal resistance and slightly reduces the overall cooling efficiency. In many systems, especially high-end ones, this drawback is compensated by various design solutions (primarily by the tightest connection of the tubes with the sole), but this, in turn, affects the cost.

— Direct. With direct contact, the heat pipes fit directly on the cooled chip, without an additional sole; for this, the surface of the tubes on the desired side is ground down to a plane. Due to the absence of intermediate parts, the thermal resistance at the places where the tubes fit is minimal, and at the same time, the radiator design itself is simpler and cheaper than with indirect contact. On the other hand, there are gaps between th...e heat pipes, sometimes very large — as a result, the surface of the serviced chip is cooled unevenly. This is partly offset by the presence of a substrate (in this case, it fills these gaps) and the use of thermal paste, however, in terms of uniformity of heat removal, direct contact is still inevitably inferior to indirect contact. Therefore, this option is found mainly in inexpensive coolers, although it can also be used in fairly performant solutions.

The material from which the substrate of the cooling system is made is the surface that is in direct contact with the cooled component (most often the processor). This parameter is especially important for models with heat pipes (see above), although it can be specified for coolers without this function. Options can be as follows: aluminium, nickel-plated aluminium, copper, nickel-plated stranded. More about them.

— Aluminium. The traditional, most common backing material. At a relatively low cost, aluminium has good thermal conductivity characteristics, is easy to grind (required for a snug fit), and well resists scratches and other irregularities, as well as corrosion. However in terms of heat removal efficiency, this material is still inferior to copper — however, this becomes noticeable mainly in advanced systems that require the highest possible thermal conductivity.

— Copper. Copper is noticeably more expensive than aluminium, but this is offset by higher thermal conductivity and, accordingly, cooling efficiency. The noticeable disadvantages of this metal include some tendency to corrosion when exposed to moisture and certain substances. Therefore, pure copper is used relatively rarely — nickel-plated substrates are more common (see below).

— Nickel-plated copper. Copper substrate with an...additional nickel coating. Such a coating increases resistance to corrosion and scratches, while it practically does not affect the thermal conductivity of the substrate and work efficiency. However this feature somewhat increases the price of the radiator, but it is found mainly in high-end cooling systems, where this moment is almost invisible against the background of the overall cost of the device.

— Nickel-plated aluminium. Aluminium substrate with an additional nickel coating. For aluminium in general, see above, and the coating makes the heatsink more resistant to corrosion, scratches, and burrs. On the other hand, it affects the cost, despite the fact that in fact, pure aluminium is often quite sufficient for efficient operation (especially since this metal itself is very resistant to corrosion). Therefore, this variant was not distributed.

Socket - processor connector - with which the corresponding cooling system is compatible.

Different sockets differ not only in compatibility with a particular CPU, but also in the configuration of the mounting place for the cooling system. So, when purchasing a processor cooling system separately, it is worth making sure that it is compatible with the socket. Nowadays, solutions are mainly produced for the following types of sockets: AMD AM2/AM3/FM1/FM2, AMD AM4, AMD AM5, AMD TR4/TRX4, Intel 775, Intel 1150, Intel 1155/1156, Intel 1366, Intel 2011/2011 v3, Intel 2066, Intel 1151/1151 v2, Intel 1200, Intel 1700.