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Comparison Deepcool AG300 vs Deepcool AG200

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Deepcool AG300
Deepcool AG200
Deepcool AG300Deepcool AG200
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Main specs
Featuresfor CPUfor CPU
Product typeair coolerair cooler
Fan
Number of fans11
Fan size92 mm92 mm
Bearinghydrodynamichydrodynamic
Min. RPM500 rpm500 rpm
Max. RPM3050 rpm3050 rpm
Speed controllerauto (PWM)auto (PWM)
Max. air flow36.75 CFM36.75 CFM
Static pressure2.89 mm H2O2.89 mm H2O
Max. TDP100 W
Air flow directionsideways (dispersion)sideways (dispersion)
replaceable
Noise level31 dB31 dB
Radiator
Heat pipes32
Heatpipe contactstraightstraight
Heatsink materialaluminium/copperaluminium/copper
Plate materialaluminiumaluminium
Socket
AMD AM4
AMD AM5
Intel 1150
Intel 1155/1156
Intel 1151 / 1151 v2
Intel 1200
Intel 1700
AMD AM4
AMD AM5
Intel 1150
Intel 1155/1156
Intel 1151 / 1151 v2
Intel 1200
Intel 1700
General
Power source4-pin4-pin
Mount typelatcheslatches
Dimensions119x77x129 mm119x77x133 mm
Height129 mm133 mm
Weight350 g304 g
Added to E-Catalogdecember 2022december 2022

Max. TDP

The maximum TDP provided by the cooling system. Note that this parameter is indicated only for solutions equipped with heatsinks (see "Type"); for separately made fans, the efficiency is determined by other parameters, primarily by the air flow values (see above).

TDP can be described as the amount of heat that a cooling system is able to remove from a serviced component. Accordingly, for the normal operation of the entire system, it is necessary that the TDP of the cooling system is not lower than the heat dissipation of this component (heat dissipation data is usually indicated in the detailed characteristics of the components). And it is best to select coolers with a power margin of at least 20 – 25% — this will give an additional guarantee in case of forced operation modes and emergency situations (including clogging of the case and reduced air exchange efficiency).

As for specific numbers, the most modest modern cooling systems provide TDP up to 100 W, the most advanced — up to 250 W and even higher.

Heat pipes

Number of heat pipes in the cooling system

The heat pipe is a hermetically sealed structure containing a low-boiling liquid. When one end of the tube is heated, this liquid evaporates and condenses at the other end, thus removing heat from the heating source and transferring it to the cooler. Nowadays, such devices are widely used mainly in processor cooling systems (see "Intended use") — they connect the substrate that is in direct contact with the CPU and the heatsink of the active cooler. Manufacturers select the number of tubes based on the overall performance of the cooler (see "Maximum TDP"); however, models with similar TDPs can still differ markedly in this parameter. In such cases, it is worth considering the following: increasing the number of heat pipes increases the efficiency of heat transfer, but also increases the dimensions, weight and cost of the entire structure.

As for the number, the simplest models provide 1 – 2 heat pipes, and in the most advanced and powerful processor systems, this number can be 7 or more.

Dimensions

General dimensions of the cooling system. For water systems (see "Type"), this paragraph indicates the size of the external radiator (the dimensions of the water block in such devices are small, and there is no need to specify them in particular).

In general, this is a fairly obvious parameter. We only note that for case fans (see ibid.), the thickness is of particular importance — it directly depends on how much space the device will take up inside the system unit. At the same time, it is customary to refer to fans with a thin case for models in which this size does not exceed 20 mm.

Height

The cooling system should fit into the computer case without any problems. The vast majority of case manufacturers indicate in the specifications the maximum height of the cooler that can be installed on their chassis. It is from this value that it is necessary to build on when choosing a cooling system. With an oversized cooler, you will have to leave the side wall of the case wide open, which violates the built-in air circulation pattern and provokes dust pollution of the internal space of the system unit.
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