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Comparison Asus PRIME X570-P vs Asus PRIME X470-PRO

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Asus PRIME X570-P
Asus PRIME X470-PRO
Asus PRIME X570-PAsus PRIME X470-PRO
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10-phase power supply system for cores and additional nodes. PWM controller ASP1405I. Ferrite chokes and ICs IR3553M.
Featuresgaming for overclockinggaming for overclocking
SocketAMD AM4AMD AM4
Form factorATXATX
Power phases10
VRM heatsink
LED lighting
Lighting syncAsus Aura SyncAsus Aura Sync
Size (HxW)305x244 mm305x244 mm
Chipset
ChipsetAMD X570AMD X470
BIOSAmiAmi
UEFI BIOS
Active cooling
RAM
DDR44 slot(s)4 slot(s)
Memory moduleDIMMDIMM
Operation mode2 channel2 channel
Max. clock frequency5100 MHz3466 MHz
Max. memory128 GB64 GB
XMP
ECC
Drive interface
SATA 3 (6Gbps)66
M.2 connector22
M.22xSATA/PCI-E 4x1xSATA/PCI-E 4x, 1xSATA/PCI-E 2x
M.2 SSD cooling
Integrated RAID controller
Expansion slots
1x PCI-E slots33
PCI-E 16x slots23
PCI Modes16x/4x16x/0x/4x, 8x/8x/4x
PCI Express4.03.0
CrossFire (AMD)
SLI (NVIDIA)
Steel PCI-E connectors
Internal connections
USB 2.022
USB 3.2 gen121
USB 3.2 gen21
Video outputs
HDMI output
HDMI versionv.1.4
DisplayPort
Integrated audio
AudiochipRealtek S1200ARealtek S1220A
Sound (channels)7.17.1
Optical S/P-DIF
Network interfaces
LAN (RJ-45)1 Gbps1 Gbps
LAN ports11
LAN controllerRealtek RTL8111HIntel I211-AT
External connections
USB 2.02
USB 3.2 gen125
USB 3.2 gen242
USB C 3.2 gen11
PS/211
Power connectors
Main power socket24 pin24 pin
CPU power8+4 pin8 pin
Fan power connectors65
Added to E-Catalogmay 2019april 2018

Power phases

The number of processor power phases provided on the motherboard.

Very simplistically, phases can be described as electronic blocks of a special design, through which power is supplied to the processor. The task of such blocks is to optimize this power, in particular, to minimize power surges when the load on the processor changes. In general, the more phases, the lower the load on each of them, the more stable the power supply and the more durable the electronics of the board. And the more powerful the CPU and the more cores it has, the more phases it needs; this number increases even more if the processor is planned to be overclocked. For example, for a conventional quad-core chip, only four phases are often enough, and for an overclocked one, at least eight may be needed. It is because of this that powerful processors can have problems when used on inexpensive low-phase motherboards.

Detailed recommendations on choosing the number of phases for specific CPU series and models can be found in special sources (including the documentation for CPU itself). Here we note that with numerous phases on the motherboard (more than 8), some of them can be virtual. To do this, real electronic blocks are supplemented with doublers or even triplers, which, formally, increases the number of phases: for example, 12 claimed phases can represent 6 physical blocks with doublers. However, virtual phases are much inferior to real ones in terms of capabilities — in fact, t...hey are just additions that slightly improve the characteristics of real phases. So, let's say, in our example, it is more correct to speak not about twelve, but only about six (though improved) phases. These nuances must be specified when choosing a motherboard.

Chipset

The chipset model installed in the motherboard. AMD's current chipset models are B450, A520, B550, X570, A620, B650, B650E, X670, X670E, X870, X870E.. For Intel, in turn, the list of chipsets looks like this: X299, H410, B460, H470, Z490, H510, B560, H570, Z590, H610, B660, H670, Z690, B760, Z790, Z890.

A chipset is a set of chips on the motherboard through which the individual components of the system interact directly: the processor, RAM, drives, audio and video adapters, network co...ntrollers, etc. Technically, such a set consists of two parts — the north and south bridges. The key element is the northbridge, it connects the processor, memory, graphics card and the southbridge (together with the devices it controls). Therefore, it is often the name of the north bridge that is indicated as the chipset model, and the south bridge model is specified separately (see below); it is this scheme that is used in traditional layout motherboards, where bridges are made in the form of separate microcircuits. There are also solutions where both bridges are combined in one chip; for them, the name of the entire chipset can be indicated.

Anyway, knowing the chipset model, you can find various additional data on it — from general reviews to special instructions. An ordinary user, usually, does not need such information, but it can be useful for various professional tasks.

Active cooling

The presence of its own built-in active cooling system.

Active cooling is called, in which heat is forcibly removed from a heated object and this function is usually provided with the help of fans. This solution is designed to reduce the thermal load on motherboards without external coolers, which anyway will be additionally installed.

Max. clock frequency

The maximum RAM clock speed supported by the motherboard. The actual clock frequency of the installed RAM modules should not exceed this indicator — otherwise, malfunctions are possible, and the capabilities of the “RAM” cannot be used to the fullest.

For modern PCs, a RAM frequency of 1500 – 2000 MHz or less is considered very low, 2000 – 2500 MHz is modest, 2500 – 3000 MHz is average, 3000 – 3500 MHz is above average, and the most advanced boards can support frequencies of 3500 – 4000 MHz and even more than 4000 MHz.

Max. memory

The maximum amount of RAM that can be installed on the motherboard.

When choosing according to this parameter, it is important to take into account the planned use of the PC and the real needs of the user. So, volumes up to 32 GB inclusive are quite enough to solve any basic problems and run games comfortably, but without a significant reserve for an upgrade. 64 GB is the optimal option for many professional use cases, and for the most resource-intensive tasks like 3D rendering, 96 GB or even 128 GB of memory will not be a limit. The most “capacious” motherboards are compatible with volumes of 192 GB or more - they are mainly top-end solutions for servers and HEDT (see “In the direction”).

You can choose this parameter with a reserve – taking into account a potential RAM upgrade, because installing additional RAM sticks is the simplest way to increase system performance. Taking this factor into account, many relatively simple motherboards support very significant amounts of RAM.

XMP

The ability of the motherboard to work with RAM modules that support XMP (Extreme Memory Profiles) technology. This technology was developed by Intel; it is used in motherboards and RAM blocks and only works if both of these system components are XMP compliant. A similar technology from AMD is called AMP.

The main function of XMP is to facilitate system overclocking (“overclocking”): special overclocking profiles are “sewn” into the memory with this technology, and if desired, the user can only select one of these profiles without resorting to complex configuration procedures. This is not only easier, but also safer: every profile added to the bar is tested for stability.

ECC

The ability of the motherboard to work with memory modules that support ECC (Error Checking and Correction) technology. This technology allows you to correct minor errors that occur in the process of working with data, and increases the overall reliability of the system; mainly used in servers.

M.2

Electrical (logical) interfaces implemented through physical M.2 connectors on the motherboard.

See above for more details on such connectors. Here we note that they can work with two types of interfaces:
  • SATA is a standard originally created for hard drives. M.2 usually supports the newest version, SATA 3; however, even it is noticeably inferior to PCI-E in terms of speed (600 MB / s) and functionality (only drives);
  • PCI-E is the most common modern interface for connecting internal peripherals (otherwise NVMe). Suitable for both expansion cards (such as wireless adapters) and drives, while PCI-E speeds allow you to fully realize the potential of modern SSDs. The maximum communication speed depends on the version of this interface and on the number of lines. In modern M.2 connectors, you can find PCI-E versions 3.0 and 4.0, with speeds of about 1 GB / s and 2 GB / s per lane, respectively; and the number of lanes can be 1, 2 or 4 (PCI-E 1x, 2x and 4x respectively)
Specifically, the M.2 interface in the characteristics of motherboards is indicated by the number of connectors themselves and by the type of interfaces provided for in each of them. For example, the entry "3xSATA / PCI-E 4x" means three connectors that can work both in SATA format and in PCI-E 4x format; and the designation "1xSATA / PCI-E 4x, 1xPCI-E 2x" means two connectors, one of which works as SATA or PCI-E 4x, and the second — only as PCI-E 2x.

M.2 SSD cooling

Motherboard-integrated cooling for M.2 SSD drives.

This connector allows you to achieve high speed, however, for the same reason, many M.2 SSDs have high heat dissipation, and additional cooling may be required to avoid overheating. Most often, the simplest radiator in the form of a metal plate is responsible for such cooling — in the case of an SSD, this is quite enough.
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