Comparison GOODRAM PX600 SSDPR-PX600-2K0-80 2 TB vs Samsung 970 EVO Plus M.2 MZ-V7S2T0BW 2 TB

Connection interface supported by an M.2 drive (see Form Factor).

All such drives use a standard hardware connector, however, different electrical (logical) interfaces can be implemented through this connector — either SATA (usually SATA 3), or PCI-E (most often in PCI-E 3.0 2x, PCI-E 3.0 4x, PCI-E 4.0 4x, PCI-E 5.0 4x). The M.2 connector on the motherboard must support the appropriate interface — otherwise the normal operation of the SSD will not be possible. Let's consider each option in more detail.

SATA 3 connectivity provides data transfer rates up to 5.9 Gbps (approx. 600 Mbps); it is considered a very simple option and is used mainly in low-cost M.2 modules. This is due to the fact that this interface was originally created for hard drives, and for faster SSD drives, its capabilities may no longer be enough.

In turn, the PCI-E interface provides higher connection speeds and allows the implementation of special technologies like NVMe (see below). The designation of such an interface indicates its version and the number of lines – for example, PCI-E 3.0 2x means version 3 with two data lines. By this designation you can determine the maximum connection speed: PCI-E version 3.0 gives just under 1 GBps per line, version 4.0 – twice as much (up to 2 GBps), 5.0 –...twice as much as the “four” (almost 4 GBps). Thus, for example, for PCI-E 5.0 4x the maximum data transfer speed will be about 15 GBps (4 lanes of almost 4 GBps). However, we note that newer and faster drives can be connected to earlier and slower M.2 connectors – except that the data transfer speed will be limited by the capabilities of the connector.

Model of the controller installed in the SSD.

The controller is a control circuit, which, in fact, ensures the exchange of information between the memory cells and the computer to which the drive is connected. The capabilities of a particular SSD module (in particular, read and write speed) largely depend on this particular scheme. Knowing the controller model, you can find detailed data on it and evaluate the capabilities of the drive. For simple everyday use, this information is usually not needed, but for professionals and enthusiasts (modders, overclockers) it can come in handy.

Nowadays, high-end controllers are produced mainly under such brands: InnoGrit, Maxio, Phison, Realtek, Silicon Motion, Samsung.

Buffer memory is a small chip on the SSD drive that acts as a data transit between the drive and the motherboard. In fact, it acts as a kind of intermediate link between the computer's RAM and the drive's own permanent memory. The buffer is used to store the most frequently requested data from the module, which reduces the access time to them — the information is sent from the cache, instead of being read from the magnetic media. Usually, the larger the buffer size, the higher the speed of the drive, all other things being equal. Also, drives with a large amount of buffer memory reduce the load on the processor.

The type of the main memory of the drive determines the features of the distribution of information over hardware cells and the physical features of the cells themselves.

— MLC. Multi Level Cell memory based on multi-level cells, each of which contains several signal levels. MLC memory cells store 2 bits of information. Has optimum indicators of reliability, power consumption and productivity. Until recently, the technology was popular in entry-level and mid-range SSD modules, now it is gradually being replaced by more advanced options in the manner of TLC or 3D MLC.

— TLC. The evolution of MLC technology. One Flash Memory Triple Level Cell can store 3 bits of information. Such a recording density somewhat increases the likelihood of errors compared to MLC, in addition, TLC memory is considered less durable. A positive feature of the nature of this technology is its affordable cost, and various design tricks can be used to improve reliability in SSDs with TLC memory.

— 3D NAND. In a 3D NAND structure, several layers of memory cells are arranged vertically, and interconnections are organized between them. This provides greater storage capacity without increasing the physical size of the drive and improves memory performance due to shorter connections for each memory cell. In SSD drives, 3D NAND memory can use MLC, TLC or QLC chips - more...details about them are described in the corresponding help paragraphs.

— 3D MLC NAND. MLC-memory has a multilayer structure — its cells are placed on the board not in one level, but in several "floors". As a result, manufacturers have achieved an increase in storage capacity without a noticeable increase in size. Also, 3D MLC NAND memory is characterized by higher reliability than the original MLC (see the relevant paragraph), at a lower manufacturing cost.

— 3D TLC NAND. "Three-dimensional" modification of the TLC technology (see the relevant paragraph) with the placement of memory cells on the board in several layers. This arrangement allows you to achieve higher capacity with smaller sizes of the drives themselves. In production, such memory is simpler and cheaper than a single-layer one.

— 3D QLC NAND. Quad Level Cell flash type with 4 bits of data in each cell. The technology is designed to make SSDs with large volumes widely available and finally retire traditional HDDs. In the 3D QLC NAND configuration, the memory is built according to a “multi-level” scheme with the placement of cells on the board in several layers. "Three-dimensional" structure reduces the cost of production of memory modules and allows you to increase the volume of drives without compromising their weight and size component.

— 3D XPoint. A fundamentally new type of memory, radically different from traditional NAND. In such drives, memory cells and selectors are located at the intersections of perpendicular rows of conductive tracks. The mechanism for recording information in cells is based on changing the resistance of the material without the use of transistors. 3D XPoint memory is simple and inexpensive to produce, and offers much better speed and durability. The prefix "3D" in the name of the technology says that the cells on the crystal are placed in several layers. The first generation of 3D XPoint received a two-layer structure and was made using a 20-nanometer process technology.

The highest speed in write mode characterizes the speed with which the module can receive information from a connected computer (or other external device). This speed is limited both by the connection interface (see "Connector"), and by the characteristics of the device of the SSD itself.

The highest data exchange rate with a computer (or other external device) that the drive can provide in read mode; in other words — the highest speed of information output from the drive to an external device. This speed is limited both by the connection interface (see "Connector"), and by the characteristics of the device of the SSD itself. Its values can vary from 100 – 500 MB / s in the slowest models to 3 Gb / s and higher in the most advanced ones.

A parameter that determines the resistance of the drive to drops and shocks during operation. Measured in G — units of overload, 1 G corresponds to the usual force of gravity. The higher the G number, the more resistant the device is to various kinds of shocks and the less likely it is to damage the data in it, say, in the event of a fall. This parameter is especially important for external drives (see Type).

The drive's time between failures is the time that it is able to continuously work without failures and malfunctions; in other words — the operating time, after which there is a high probability of failures, and even failure of the module.

Usually, the characteristics indicate some average time derived from the results of conditional testing. Therefore, the actual value of this parameter may differ from the claimed one in one direction or another; however, in fact, this moment is not particularly significant. The fact is that for modern SSDs, the MTBF is estimated at millions of hours, and 1 million hours corresponds to more than 110 years — while we are talking about pure operating time. So, from a practical point of view, the durability of a drive is often limited by more specific parameters — TBW and DPWD (see below); and the manufacturer's warranty generally does not exceed several years. However, data on the MTBF in hours can also be useful when choosing: other things being equal, more time means more reliability and durability of the SSD as a whole.

The IOPS provided by the drive in write mode.

The term IOPS refers to the highest number of I / O operations that an SSD module can perform per second, in this case, when writing data. By this indicator, the speed of the drive is often evaluated; however, this is not always true. Firstly, the IOPS values of different manufacturers can be measured in different ways — by the maximum value, by average, by random write, by sequential write, etc. Secondly, the benefits of high IOPS become noticeable only with some specific operations — in in particular, the simultaneous copying of numerous files. In addition, in fact, the speed of the drive may be limited by the system to which it is connected. In light of all this, it is generally acceptable to compare different SSD modules by IOPS, but the real difference in performance is likely not to be as noticeable as the difference in numbers.

As for specific values, for the write mode with IOPS up to 50K is considered relatively modest, 50 – 100K — medium, more than 100K — high.