Обсуждение вопросов по A-Data XPG Gammix D10 DDR4 2x16Gb AX4U320016G16A-DB10
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14 ноября 2021, 22:23
Вопрос про A-Data AX4U320016G16A-DB10 Подскажите, какой ранк у плашек? и на каких чипах?
| Rus28 декабря 2021, 22:21 |
попались Samsung M-Die (AX4U3200716G16A-DB10) rank1
MEMORY MODULE
MANUFACTURER
A-DATA Technology
SERIES
Not determined
PART NUMBER
DDR4 3200
SERIAL NUMBER
720E0400h
JEDEC DIMM LABEL
16GB 1Rx8 PC4-2666V-UA2-11
ARCHITECTURE
DDR4 SDRAM UDIMM
SPEED GRADE
DDR4-2666V downbin
CAPACITY
16 GB (8 components)
ORGANIZATION
2048M x64 (1 rank)
REGISTER MODEL
N/A
MANUFACTURING DATE
December 21-25 / Week 52, 2020
MANUFACTURING LOCATION
Suzhou, China
REVISION / RAW CARD
4D00h / A2 (8 layers)
DRAM COMPONENTS
MANUFACTURER
Samsung
K4AAG085WM-BCRC
PACKAGE
DIE DENSITY / COUNT
16 Gb M-die (17 nm) / 1 die
COMPOSITION
2048Mb x8 (128Mb x8 x 16 banks)
CLOCK FREQUENCY
1333 MHz (0,750 ns)
MINIMUM TIMING DELAYS
19-19-19-43-61
READ LATENCIES SUPPORTED
20T, 19T, 18T, 17T, 16T, 15T, 14T...
SUPPLY VOLTAGE
1,20 V
XMP CERTIFIED
1600 MHz / 16-20-20-38-58 / 1,35 V
XMP EXTREME
Not programmed
SPD REVISION
1.1 / September 2015
XMP REVISION
2.0 / December 2013
MEMORY MODULE
MANUFACTURER
A-DATA Technology
SERIES
Not determined
PART NUMBER
DDR4 3200
SERIAL NUMBER
720E0400h
JEDEC DIMM LABEL
16GB 1Rx8 PC4-2666V-UA2-11
ARCHITECTURE
DDR4 SDRAM UDIMM
SPEED GRADE
DDR4-2666V downbin
CAPACITY
16 GB (8 components)
ORGANIZATION
2048M x64 (1 rank)
REGISTER MODEL
N/A
MANUFACTURING DATE
December 21-25 / Week 52, 2020
MANUFACTURING LOCATION
Suzhou, China
REVISION / RAW CARD
4D00h / A2 (8 layers)
DRAM COMPONENTS
MANUFACTURER
Samsung
K4AAG085WM-BCRC
PACKAGE
DIE DENSITY / COUNT
16 Gb M-die (17 nm) / 1 die
COMPOSITION
2048Mb x8 (128Mb x8 x 16 banks)
CLOCK FREQUENCY
1333 MHz (0,750 ns)
MINIMUM TIMING DELAYS
19-19-19-43-61
READ LATENCIES SUPPORTED
20T, 19T, 18T, 17T, 16T, 15T, 14T...
SUPPLY VOLTAGE
1,20 V
XMP CERTIFIED
1600 MHz / 16-20-20-38-58 / 1,35 V
XMP EXTREME
Not programmed
SPD REVISION
1.1 / September 2015
XMP REVISION
2.0 / December 2013
