Intel Core i3 Skylake i3-6100TE OEM (CM8066201938603)
 | Outdated Product Socket: Intel LGA 1151; Cores (cores): 2; Threads (threads): 4; Speed (GHz): 2.7; IGP: HD Graphics 530; PCI Express: 3.0; |
 |
Close
We recommend products in stockCPUs Intel →
Intel LGA 1151, cores 2, threads 4, 3.2 GHz, process technology 14 nm, HD Graphics 530, integrated graphics, multithreading, TDP 35 W, память ОЗУ: maximum 64 GB, DDR4 2133 MHz
Intel LGA 1151, cores 2, threads 2, 2.9 GHz, process technology 14 nm, HD Graphics 610, integrated graphics, TDP 51 W, память ОЗУ: maximum 64 GB, DDR4 2133 MHz
Intel LGA 1151, cores 2, threads 2, 2.9 GHz, process technology 14 nm, HD Graphics 510, integrated graphics, TDP 51 W, память ОЗУ: maximum 64 GB, DDR4 2133 MHz
Intel LGA 1151, cores 2, threads 2, 2.8 GHz, process technology 14 nm, HD Graphics 510, integrated graphics, TDP 51 W, память ОЗУ: maximum 64 GB, DDR4 2133 MHz
Intel LGA 1151, cores 4, threads 4, 2.7 GHz, TurboBoost 3.3 GHz, process technology 14 nm, HD Graphics 530, integrated graphics, TDP 65 W, память ОЗУ: maximum 64 GB, DDR4 2133 MHz
Intel LGA 1151, cores 4, threads 4, 3.2 GHz, TurboBoost 3.6 GHz, process technology 14 nm, HD Graphics 530, integrated graphics, TDP 65 W, память ОЗУ: maximum 64 GB, DDR4 2133 MHz
Intel LGA 1151, cores 4, threads 4, 2.5 GHz, TurboBoost 3.1 GHz, process technology 14 nm, HD Graphics 530, integrated graphics, TDP 35 W, память ОЗУ: maximum 64 GB, DDR4 2133 MHz
Intel LGA 1151, cores 4, threads 4, 3 GHz, TurboBoost 3.5 GHz, process technology 14 nm, HD Graphics 630, integrated graphics, TDP 65 W, память ОЗУ: maximum 64 GB, DDR4 2400 MHz
Intel LGA 1151, cores 4, threads 4, 2.7 GHz, TurboBoost 3.3 GHz, process technology 14 nm, HD Graphics 630, integrated graphics, TDP 35 W, память ОЗУ: maximum 64 GB, DDR4 2400 MHz
Intel LGA 1151, cores 4, threads 4, 2.7 GHz, TurboBoost 3.3 GHz, process technology 14 nm, HD Graphics 630, integrated graphics, TDP 35 W, память ОЗУ: maximum 64 GB, DDR4 2400 MHz
Intel LGA 1151, cores 4, threads 4, 3.2 GHz, TurboBoost 3.6 GHz, process technology 14 nm, HD Graphics 530, integrated graphics, TDP 65 W, память ОЗУ: maximum 64 GB, DDR4 2133 MHz
Intel LGA 1151, cores 4, threads 4, 2.7 GHz, TurboBoost 3.3 GHz, process technology 14 nm, HD Graphics 530, integrated graphics, TDP 65 W, память ОЗУ: maximum 64 GB, DDR4 2133 MHz
Intel LGA 1151, cores 4, threads 4, 3 GHz, TurboBoost 3.5 GHz, process technology 14 nm, HD Graphics 630, integrated graphics, TDP 65 W, память ОЗУ: maximum 64 GB, DDR4 2400 MHz
Intel Core i3 Skylake i3-6100TE OEM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
| |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Why is the new processor faster at the same frequency?The main factors that make new processes faster without increasing clock speeds
How to choose a CPU?How to choose the right CPU for any task, from spreadsheets to modern games and work applications
Information in model description is for reference purposes.
Before buying always check characteristics and configuration of product with online store manager
Catalog Intel 2024 - new products, best sales and most actual models Intel.
Before buying always check characteristics and configuration of product with online store manager
Catalog Intel 2024 - new products, best sales and most actual models Intel.
AccessoriesAll accessories for Intel i3-6100TE OEM →
Add Review
anonim
18 October 2021, 11:30
замена intel core i36300 на intel core i7 kabylake i7-7700 BOX ? #
По сокету подходит! Socket 1151LGA.
А как чипсет и биос ?
Системная плата Gigabyte GA-Z170-D3H
chipset Skylake
Версия BIOS F21
Разъём DRAM 1 16 ГБ (DDR4 SDRAM)
Разъём DRAM 2 8 ГБ (DDR4 SDRAM)
А как чипсет и биос ?
Системная плата Gigabyte GA-Z170-D3H
chipset Skylake
Версия BIOS F21
Разъём DRAM 1 16 ГБ (DDR4 SDRAM)
Разъём DRAM 2 8 ГБ (DDR4 SDRAM)
